Available globally, these new models target data centers across North America and EMEA, addressing the increasing demands of modern AI workloads.
Positioned as a hybrid solution, MegaMod HDX combines direct-to-chip liquid cooling with traditional air cooling to effectively manage heat generated by GPU-intensive systems and pod-style architectures. This approach aims to optimize thermal management while supporting the high power densities associated with AI infrastructure.
Vertiv introduced two configurations:
Compact Version: Supports up to 13 racks with a total power capacity of approximately 1.25 MW. It features a standard module height and is suitable for facilities with space constraints but high-density needs.
Combo Version: An extended-height design supporting up to 144 racks and up to 10 MW of power. This version caters to larger, scale-out AI deployments requiring extensive cooling and power infrastructure.
Both variants support rack densities ranging from 50 kW to over 100 kW per rack, reflecting the shift toward ultra-high-density AI compute environments.
MegaMod HDX’s core innovation lies in its integration of direct-to-chip liquid cooling with air-cooled architectures, enabling efficient thermal management for intensive AI workloads. The prefabricated, modular design aims to reduce on-site construction time, standardize deployment processes, and facilitate scalability.
The system features a distributed redundant power architecture, ensuring continued operation even if individual modules fail. Additionally, a buffer-tank thermal backup helps GPU clusters maintain stable performance during maintenance or load transitions, enhancing operational resilience in mission-critical environments.
Vertiv emphasizes that the MegaMod HDX comes with fully tested, factory-integrated components, streamlining deployment. Its extensive global service network ensures ongoing support and maintenance, critical for data centers operating at high availability standards.
